Email Address

Subject

1. What is the quantity of wafers to be diced?

2. Will the whole wafer be diced? If not, please explain.

3. Provide a wafer dicing map or other visual guide to the dicing requirements:

4. What is the wafer diameter?

5. What is the wafer material? If non-standard, please explain.

6. What is the wafer thickness as we will receive it?

7. What is the die size?

8. What is the wafer street width?

9. Are there features or metallization in the saw street?

10. Are there features or metallization on the backside of the wafer?

11. Is this a MEMS wafer or are there any un-passivated or fragile structures on the die surface requiring special handling? If yes, please explain.

12. Are there ESD handling needs? If yes, please explain.

13. Is post-dicing inspection required? If yes, please explain.

14. All die will be delivered to you unless otherwise specified. How do you want the die delivered back to you?

15. Should edge material be discarded? If not, please explain.

16. Set-up material is required for verification of dicing parameters. Is set-up material available? If not, please explain.

17. Are there any other special needs not mentioned above? If yes, please explain.

DICING REQUEST FORM