SMART Microsystems works with Design Engineers who need high-quality, low volume microelectronic sub-assemblies for their innovative new products. As North America’s leading full-service microelectronic assembly supplier, SMART Microsystems takes complete responsibility for custom process development for your new design, taking it from prototyping through launch in less overall time and cost than other package assembly suppliers.
NEW SMART Capabilities Brochure Available for DOWNLOAD
SMART Microsystems has an experienced technical team, state-of-the-art equipment, and brand-new facilities occupying 15,000 sq. ft. of space, including 5,000 sq. ft. of world-class ISO 6 (class 1000) and ISO 5 (class 100) cleanroom facilities...
SMART MICROSYSTEMS' TECHNICAL CAPABILITIES INCLUDE:
• Test and Inspection
• Wafer Dicing, Inspection and Sorting
• Die Attach/Flip Chip
• Wire Bonding
• Encapsulation and Dispensing
• Environmental Life Test
• Failure Analysis Services
SMART Microsystems’ William Boyce Discusses Destructive Wire Bond Pull Testing and Its Purpose in the Fall 2019 Issue of the MEPTEC Report
NEW Environmental Life Test Brochure Available for DOWNLOAD
