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SMART Microsystems works with Design Engineers who need high-quality, low volume microelectronic sub-assemblies for their innovative new products. As North America’s leading full-service microelectronic assembly supplier, SMART Microsystems takes complete responsibility for custom process development for your new design, taking it from prototyping through launch in less overall time and cost than other package assembly suppliers.


TEST & INSPECTION AND FAILURE ANALYSIS Precision Measurement
Acoustic Microscopy
Scanning Electron Microscopy (SEM)
3D X-Ray
Pressure Controller
Interferometry
Bond Testing

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WAFER DICING, INSPECTION AND SORTING • Wafer Dicing
Wafer Inspection
Die Sort

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DIE ATTACH
Die Attach
Solder Reflow
Vacuum Solder Reflow

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WIRE BONDING
Fine Gauge Wire / Ribbon Bonding
Heavy Gauge Wire / Ribbon Bonding
Gold Ball Bonding

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ENCAPSULATION AND DISPENSING
Adhesive Dispense
Lid Seal
Parylene Coating

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RELIABILITY AND ENVIRONMENTAL LIFE TEST • HAST
Thermal/Humidity Cycling & Steady-State
Thermal Shock
Super UV Testing

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